Sign In | Join Free | My ismap.com
China Shenzhen Xinchenger Electronic Co.,Ltd logo
Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
Site Member

9 Years

Home > Fr4 PCB >

High 170 TG double sided pcb , FR4 Mixed Rogers Satellite Radio PCB 0.8 mm

Shenzhen Xinchenger Electronic Co.,Ltd

High 170 TG double sided pcb , FR4 Mixed Rogers Satellite Radio PCB 0.8 mm

  • 1
  • 2
  • 3

Brand Name : XCE

Model Number : XCE BK888

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Green

Material : FR4 +Rogers Material

Layer : 2

Board Size : 16*28cm

Copper Thinknes : 1 oz

Min Line Width : 4 mil

Min Line Space : 4mil

Surface Finish : Lead-free hasl

Name : Rogers pcb

Contact Now

High 170 TG double sided pcb , FR4 Mixed Rogers Satellite Radio PCB 0.8 mm

Products Details

Raw Material FR-4 (Tg 170 available)
Layer Count 2-Layer
Board Thickness 0.8mm
Copper Thickness 1.0oz
Surface Finish ENIG(Electroless Nickel Immersion Gold)
Solder Mask Black
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 200×500mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

Parameter:

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2



PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.


Product Tags:

pcb manufacturing process

      

Custom Printed Circuit Board

      
Buy cheap High 170 TG double sided pcb , FR4 Mixed Rogers Satellite Radio PCB 0.8 mm product

High 170 TG double sided pcb , FR4 Mixed Rogers Satellite Radio PCB 0.8 mm Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Xinchenger Electronic Co.,Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0